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Y2K Compliance Info



SEMICONDUCTOR INDUSTRY EQUIPMENT

Inspection Microscope

Autoloader

Flatness Tester



OPHTHALMIC EQUIPMENT



DIAGNOSTIC EQUIPMENT



LENS EDGERS



SURGICAL LASER EQUIPMENT


 

FT-900 DIGITAL WAFER FLATNESS TESTER


FT-900

Applicable Size

Wafer : Ø 100, 125, 150 and 200mm
Aluminum & Glass Disk : Ø 2.5" and 3.5"


FEATURES

  • Fringe Scan Analysis is adopted to comply with multiple interference fringe.
  • Easy operation with the system controlled by personal computer (Windows 95).
  • High accuracy TTV measurement is possible by the auto calculation function for TTV referential surface (Option). -- Vacuum chuck surface is directly measured with the interferometer at every measurement (Patent Pending).
  • Daily calibration of the laser interferometer is not necessary -- By the periodical check of the measurement sensitivity, the system can be usable without daily calibration.
  • Three kinds of data processing are possible:
    1. Data analysis by setting the wafer surface as an average plane
    2. Data analysis based on the plane determined by three points on the wafer surface
    3. Data analysis based on the vacuum chuck surface
  • Vacuum sucking or non vacuum sucking measurement is selectable.
  • With use of the Stepper Simulation Function, site flatness measurement and the analysis by the stored data are possible (Option).
  • In the site flatness measurement, standard plane is switchable; top wafer surface or bottom wafer surface.
  • With use of the Film Stress Analysis Function, analysis of the entire stress and strength distribution status before and after the spattering is possible.



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